Method and apparatus for grinding wafer

  • Inventors:
  • Assignees: Hitachi Ltd
  • Publication Date: May 28, 1980
  • Publication Number: JP-S5571026-A

Abstract

PURPOSE: To reduce vibrations and shocks such as striking of ground particles in grinding works and to prevent yields of scraches caused by rubbing, by intervening a flexible thin film between a fixing table and a wafer, in the case the wafer which is fixed by the fixing table is ground by a grindstone. CONSTITUTION: A fixing table 6 having a plurality of air holes 9 is fixed to a chuck-base plate 8 by fixing screws 7, and flexible thin film 11 having a plurality of slits 12 is placed on or bonded to the upper surface of the table 6. The slits 12 are alingned with the holes 9. A wafer 2 is mounted on a the film 11, and is attracted by evacuation of air in an air hole 10, the holes 9, and the slits 12, thereby the film 11 and the wafer 2 are held. Then, the grinding is performed by a rotary grindstone 1. COPYRIGHT: (C)1980,JPO&Japio

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Patent Citations (2)

    Publication numberPublication dateAssigneeTitle
    JP-S52155494-ADecember 23, 1977Nippon Telegr & Teleph Corp Process for w orking parallel plane of wafer
    JP-S5342458-UApril 12, 1978

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2004510334-AApril 02, 2004ストラスバウStrasbaughチャック上に背面研磨テープを残したままウェーハを背面研磨する方法
    JP-S56169332-ADecember 26, 1981Nec Home Electronics LtdManufacture of semiconductor device
    JP-S6394630-AApril 25, 1988Rohm Co LtdProcessing of rear of semiconductor wafer