PURPOSE: To reduce vibrations and shocks such as striking of ground particles in grinding works and to prevent yields of scraches caused by rubbing, by intervening a flexible thin film between a fixing table and a wafer, in the case the wafer which is fixed by the fixing table is ground by a grindstone.
CONSTITUTION: A fixing table 6 having a plurality of air holes 9 is fixed to a chuck-base plate 8 by fixing screws 7, and flexible thin film 11 having a plurality of slits 12 is placed on or bonded to the upper surface of the table 6. The slits 12 are alingned with the holes 9. A wafer 2 is mounted on a the film 11, and is attracted by evacuation of air in an air hole 10, the holes 9, and the slits 12, thereby the film 11 and the wafer 2 are held. Then, the grinding is performed by a rotary grindstone 1.